G06100 - SEMI G61 - Specification for Cofired Ceramic Packages StdPbc-0309 The purpose of this Specification

The purpose of this Specification is to simplify cluster tool implementation in the fab

Subramanian Lyer of UCLA

SEMI E88-0999 (first published)

or electronic substrate materials

G06100 - SEMI G61 - Specification for Cofired Ceramic Packages StdPbc-0309 The purpose of this SpecificationThis specification defines the materials and acceptance criteria for high temperature, cofired ceramic packages. Referenced SEMI Standards SEMI G6 Seal Ring Flatness SEMI G8 Gold Plating Temperature Resistance SEMI G23 Measuring the Inductance of Package Leads SEMI G24 Measuring the Lead to Lead and Loading Capacitance of Package Leads SEMI G25 Measuring the Resistance of Package