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This Test Method is intended primarily for use on electronic materials in the form of nominally circular edge-contoured wafers with flat lengths up to 65 mm
Semiconductor processing equipment is especially vulnerable to voltage sags
This Standard specifies measurement methods
영문원본과 한글본간에 차이가 발생할 경우
S01600 - SEMI S16 - Guide for Semiconductor Manufacturing Equipment Design for Reduction of Environmental Impact at End of Life Revision:SEMI S16-0600 - Superseded This Test Method is intendedThis Standard was technically approved by the Environmental, Health, & Safety Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on June 18, 2012. Available at www. semiviews. org and www. semi. org in August 2012; originally published June 2000; previously published March 2007. NOTICE: This Document was reapproved with minor editorial changes. NOTICE: This Standard or Safety Guideline